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STPS5L25B/B-1
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 5A 25 V 150C 0.35 V
4 4
2 3 4 (TAB)
FEATURES AND BENEFITS VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS HIGH POWER SURFACE MOUNT MINIATURE PACKAGE AVALANCHE RATED DESCRIPTION Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters. This device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS units. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 145C = 0.5 tp = 10 ms Sinusoidal tp=2 s square F=1kHz tp = 100 s square Parameter Repetitive peak reverse voltage Value 25 7 5 75 1 2 - 65 to + 150 150 10000 Unit V A A A A A C C V/s
2 1
NC
3 3 2 1
NC
DPAK STPS5L25B
IPAK STPS5L25B-1
dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j-a) dTj
1/5
August 1999 - Ed: 3A
STPS5L25B/B-1
THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Parameter Value 2.5 Unit C/W
STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Tests Conditions Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C
Pulse test : * tp = 380 s, < 2%
Min.
Typ. 55
Max. 350 115 0.47 0.35 0.59 0.50
Unit A mA V
VR = VRRM IF = 5 A IF = 5 A IF = 10 A IF = 10 A 0.41 0.31
To evaluate the maximum conduction losses use the following equation : P = 0.2 x IF(AV) + 0.030 IF2(RMS)
Fig. 1: Average forward power dissipation versus average forward current.
PF(av)(W) 2.5 2.0 1.5 1.0
T
Fig. 2: Average forward current versus ambient temperature (=0.5).
6 IF(av)(A)
Rth(j-a)=Rth(j-c)
= 0.1 = 0.05
= 0.2
= 0.5
5 4
=1
3 2
Rth(j-a)=70C/W
T
0.5 IF(av) (A) 0.0 0 1 2 3 4
=tp/T
tp
1
5
6
0
=tp/T
tp
Tamb(C) 50 75 100 125 150
0
25
2/5
STPS5L25B/B-1
Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values).
100 80 60 40
Tc=100C Tc=25C Tc=75C
Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration.
Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4
= 0.5
IM(A)
= 0.2
T
20 0 1E-3
IM t
0.2
=0.5
Single pulse = 0.1
t(s) 1E-2 1E-1 1E+0
tp(s) 0.0 1.0E-4 1.0E-3 1.0E-2
=tp/T
tp
1.0E-1
1.0E+0
Fig. 5: Reverse leakage current versus reverse voltage applied (typical values).
3E+2 1E+2 1E+1 1E+0 1E-1
Tj=25C
Fig. 6: Junction capacitance versus reverse voltage applied (typical values).
C(pF)
IR(mA)
Tj=150C
2000
F=1MHz Tj=25C
Tj=125C
1000 500
1E-2 VR(V) 1E-3 0 5 10 15 20 25
200 VR(V) 100 1 2 5 10 20 30
Fig. 7: Forward voltage drop versus forward current (maximum values).
Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m).
Rth(j-a) (C/W) 100
100.0
IFM(A)
Typical values Tj=150C
80
Tj=125C
10.0
60 40
1.0
Tj=25C
20
VFM(V)
0.1 0.0
0
0
2
4
6
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
8 10 12 S(Cu) (cm)
14
16
18
20
3/5
STPS5L25B/B-1
PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 FOOT PRINT DIMENSIONS (in millimeters)
6.7
Millimeters Min. Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0 8
Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0 8
6.7
3 3 1.6 2.3 2.3 1.6
4/5
STPS5L25B/B-1
PACKAGE MECHANICAL DATA IPAK DIMENSIONS REF. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 Millimeters Min.
A E B2 L2 C2
Inches Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.033 0.035 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.031 0.039 10 0.086 0.035 0.027 0.025 0.204
Typ. Max. Min. 2.4 1.1 1.3 0.9 5.4 0.85 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1
2.2 0.9 0.7 0.64 5.2
D
H L
L1
B6
B3 B V1 A1
B5 G
C A3
0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 10
0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031
Ordering type STPS5L25B STPS15LB-TR STPS5L25B-1
Marking STPS5L25B STPS5L25B STPS5L25B
Package DPAK DPAK IPAK
Weight 0.30g 0.30g 0.35g
Base qty 75 2500 75
Delivery mode Tube Tape & reel Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5

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